Title: Grain structure evolution during annealing of electroplated copper
Authors: Brongersma, Sywert ×
Kerr, Emma
Vervoort, Iwan
Maex, Karen #
Issue Date: 2002
Publisher: AIP
Host Document: pages:229-234
Conference: Stress-Induced Phenomena in Metallization: 6th International Workshop location:Leuven Belgium date:25/07/01
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

Files in This Item:

There are no files associated with this item.

Request a copy


All items in Lirias are protected by copyright, with all rights reserved.