|ITEM METADATA RECORD
|Title: ||Grain structure evolution during annealing of electroplated copper|
|Authors: ||Brongersma, Sywert ×|
Maex, Karen #
|Issue Date: ||2002 |
|Host Document: ||pages:229-234|
|Conference: ||Stress-Induced Phenomena in Metallization: 6th International Workshop location:Leuven Belgium date:25/07/01|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
× corresponding author|
# (joint) last author|
|Files in This Item:
There are no files associated with this item.
Request a copy
All items in Lirias are protected by copyright, with all rights reserved.