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Title: Continued scalability of copper/low-k interconnects
Authors: Brongersma, Sywert
Carbonell, Laure
Vanstreels, Kris
Iacopi, Francesca
D'Haen, Jan
Zhang, Wenqi
Travaly, Youssef
Demuynck, Steven
Tokei, Zsolt
De Ceuninck, Ward
Maex, Karen
Issue Date: 2005
Conference: MRS Spring Symposium B: Materials, Technology, and Reliability of Advanced Interconnects location:San Francisco, CA, USA date:28/03/05
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Electrical Engineering - miscellaneous
Associated Section of ESAT - INSYS, Integrated Systems

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