This item still needs to be validated !
Title: Study of Cu diffusion in an Al-1%Si-0.5%Cu bond pad with an Al-1%Si bond wire attached using scanning electron microscopy
Authors: Cosemans, P ×
D'Haen, Jan
Witvrouw, Ann
Proost, Joris
D'olieslaeger, Marc
De Ceuninck, Ward
Maex, Karen
De Schepper, Luc #
Issue Date: 1998
Series Title: Microelectronics Reliability vol:38 issue:3 pages:309-15
ISSN: 0026-2714
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Department of Materials Engineering - miscellaneous
Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

Files in This Item:

There are no files associated with this item.

Request a copy


All items in Lirias are protected by copyright, with all rights reserved.

© Web of science