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|ITEM METADATA RECORD
|Title: ||Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect|
|Authors: ||Zhang, Wenqi|
Van Aelst, Joke
|Issue Date: ||2005 |
|Conference: ||Advanced Metallization Conference location:Colorado Springs CO USA date:27/09/05|
|Publication status: ||published|
|KU Leuven publication type: ||IMa|
|Appears in Collections:||Electrical Engineering - miscellaneous|
Associated Section of ESAT - INSYS, Integrated Systems
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