This item still needs to be validated !
Title: Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect
Authors: Zhang, Wenqi
Brongersma, Sywert
Van Aelst, Joke
Richard, Olivier
Bamal, Mandeep
Heylen, Nancy
Li, Yunlong
Beyer, Gerald
Maex, Karen
Issue Date: 2005
Conference: Advanced Metallization Conference location:Colorado Springs CO USA date:27/09/05
Publication status: published
KU Leuven publication type: IMa
Appears in Collections:Electrical Engineering - miscellaneous
Associated Section of ESAT - INSYS, Integrated Systems

Files in This Item:

There are no files associated with this item.


All items in Lirias are protected by copyright, with all rights reserved.