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Title: Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect
Authors: Zhang, Wenqi
Brongersma, Sywert
Van Aelst, Joke
Richard, Olivier
Bamal, Mandeep
Heylen, Nancy
Li, Yunlong
Beyer, Gerald
Maex, Karen
Issue Date: 2005
Conference: Advanced Metallization Conference location:Colorado Springs CO USA date:27/09/05
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Electrical Engineering - miscellaneous
Associated Section of ESAT - INSYS, Integrated Systems

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