Title: Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects
Authors: Baklanov, Mikhaïl ×
Muroyama, M
Judelewicz, Moshe
Kondoh, Eiichi
Li, H
Waeterloos, Joost
Vanhaelemeersch, Serge
Maex, Karen #
Issue Date: 1999
Series Title: Journal of Vacuum Science & Technology B, Microelectronics and Nanometer Structures vol:17 issue:5 pages:2136-2146
ISSN: 1071-1023
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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