Title: Wafer-level packaging technology for extended global wiring and inductors
Authors: Carchon, Geert
Carbonell, Laure
Jenei, Snezana
Van Hove, Marleen
Decoutere, Stefaan
De Raedt, Walter
Maex, Karen
Beyne, Eric #
Issue Date: 2003
Conference: 33rd European Solid-State Devices Research Conference - ESSDERC location:Estoril Portugal date:16/09/03
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
# (joint) last author

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