|ITEM METADATA RECORD
|Title: ||Wafer-level packaging technology for extended global wiring and inductors|
|Authors: ||Carchon, Geert|
Van Hove, Marleen
De Raedt, Walter
Beyne, Eric #
|Issue Date: ||2003 |
|Conference: ||33rd European Solid-State Devices Research Conference - ESSDERC location:Estoril Portugal date:16/09/03|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
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