Evaluation of post metal etch cleaning by analyzing chemical compositions and distributions

Li, H; Baklanov, Mikhaïl; Boullart, Werner; Conard, Thierry; Brijs, Bert; Maex, Karen; Froyen, Ludo

doi:10.4028/www.scientific.net/SSP.65-66.177

Evaluation of post metal etch cleaning by analyzing chemical compositions and distributions

Author:

Li, H

Baklanov, Mikhaïl ; Boullart, Werner ; Conard, Thierry ; Brijs, Bert ; Maex, Karen ; Froyen, Ludo

Keywords:

Science & Technology, Technology, Physical Sciences, Materials Science, Multidisciplinary, Physics, Applied, Physics, Condensed Matter, Materials Science, Physics, post metal etch strip, downstream H2O-based plasma, XPS, ALUMINUM, 0204 Condensed Matter Physics, 0912 Materials Engineering, Applied Physics, 4016 Materials engineering

Abstract:

© (1999) Trans Tech Publications, Switzerland. The post metal etch strip process in downstream H2O-based plasma followed by a wet chemistry has been evaluated. Results on the cvolusion of surface compositions and species during each cleaning step are presented. It is argued that the formation and subsequently the removal of the surface layer by the cleaning process plays a critical role in reducing the chlorine concentration.