Title: Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper
Authors: Brongersma, Sywert ×
Vervoort, Iwan
Judelewicz, Moshe
Bender, Hugo
Conard, Thierry
Vandervorst, Wilfried
Beyer, Gerald
Richard, Emmanuel
Palmans, Roger
Lagrange, Sébastien
Maex, Karen #
Issue Date: 1999
Host Document: pages:290-292
Conference: Proceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA. location:Leuven Belgium
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
Electrical Engineering - miscellaneous
× corresponding author
# (joint) last author

Files in This Item:

There are no files associated with this item.

Request a copy


All items in Lirias are protected by copyright, with all rights reserved.