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|ITEM METADATA RECORD
|Title: ||Indium solder bump technology for ultra high density interconnects in hybrid image sensors|
|Authors: ||John, Joachim ×|
De Moor, Piet
De Kerckhove, Alex
De Munck, Koen
Van Hoof, Chris #
|Issue Date: ||Jun-2005 |
|Host Document: ||pages:334-337|
|Conference: ||Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition - IMAPS/EMPC location:Leuven Belgium date:12/06/05|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Electrical Engineering - miscellaneous|
ESAT - MICAS, Microelectronics and Sensors
× corresponding author|
# (joint) last author|
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