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Title: Indium solder bump technology for ultra high density interconnects in hybrid image sensors
Authors: John, Joachim ×
De Moor, Piet
Colin, Thierry
De Kerckhove, Alex
Borgers, Tom
Hooylaerts, Peter
De Munck, Koen
Tezcan, Denizs
Van Hoof, Chris #
Issue Date: Jun-2005
Publisher: IMAPS
Host Document: pages:334-337
Conference: Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition - IMAPS/EMPC location:Leuven Belgium date:12/06/05
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Electrical Engineering - miscellaneous
ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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