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Title: Integration of single damascene 85/85nm/L/S copper trenches in black diamond using 193nm optical lithography with dipole illumination
Authors: Van Olmen, Jan ×
Wu, Wen
Van Hove, Marleen
Travaly, Youssef
Brongersma, Sywert
Eyckens, Brenda
Maenhoudt, Mireille
Van Aelst, Joke
Struyf, Herbert
Demuynck, Steven
Tokei, Zsolt
Vervoort, Iwan
Sijmus, Bram
Vos, Ingrid
Ciofi, Ivan
Stucchi, Michele
Maex, Karen
Iacopi, Francesca #
Issue Date: 2003
Publisher: IEEE
Host Document: pages:171-173
Conference: Proceedings of the IEEE International Interconnect Technology Conference - IITC location:Leuven Belgium date:02/06/03
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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