|ITEM METADATA RECORD
|Title: ||Influence of plating conditions on the dynamics of copper grain growth during thermal annealing|
|Authors: ||Brongersma, Sywert|
De Ceuninck, Ward
|Issue Date: ||2003 |
|Conference: ||MRS Spring Meeting Symposium E: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics location:San Francisco, CA, USA date:21/04/03|
|Publication status: ||published|
|KU Leuven publication type: ||DI|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
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