Title: Influence of plating conditions on the dynamics of copper grain growth during thermal annealing
Authors: Brongersma, Sywert
D'Haen, Jan
Vanstreels, Kris
De Ceuninck, Ward
Maex, Karen
Issue Date: 2003
Conference: MRS Spring Meeting Symposium E: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics location:San Francisco, CA, USA date:21/04/03
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems

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