Title: Copper seed layer scaling for advanced interconnects: extendibility of I-PVD
Authors: Tokei, Zsolt ×
Demuynck, Steven
Vervoort, Iwan
Mebarki, Bencherki
Mandrekar, T
Guggilla, S
Maex, Karen #
Issue Date: 2003
Publisher: MRS
Host Document: pages:403-407
Conference: Proceedings of the Advanced Metallization Conference 2002 location:Leuven Belgium date:01/10/02
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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