Title: Hybrid integration of multi-finger HEMTs: A comparison between flip-chip and substrate removal
Authors: Das, Johan
Ruythooren, Wouter
Vandersmissen, Raf
Oprins, Herman
Derluyn, Joff
Germain, Marianne
Borghs, Gustaaf #
Issue Date: 2005
Host Document: International Conference on Nitride Semiconductors
Conference: International Conference on Nitride Semiconductors location:Leuven Belgium date:28/08/05
Publication status: published
KU Leuven publication type: IMa
Appears in Collections:Applied Mechanics and Energy Conversion Section
Physics and Astronomy - miscellaneous
# (joint) last author

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