|ITEM METADATA RECORD
|Title: ||Hybrid integration of multi-finger HEMTs: A comparison between flip-chip and substrate removal|
|Authors: ||Das, Johan|
Borghs, Gustaaf #
|Issue Date: ||2005 |
|Host Document: ||International Conference on Nitride Semiconductors|
|Conference: ||International Conference on Nitride Semiconductors location:Leuven Belgium date:28/08/05|
|Publication status: ||published|
|KU Leuven publication type: ||IMa|
|Appears in Collections:||Applied Mechanics and Energy Conversion Section|
Physics and Astronomy - miscellaneous
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