Title: Parameterised modelling of thermo-mechanical reliability for CSP assemblies
Authors: Vandevelde, Bart ×
Beyne, Eric
Zhang, K.G.Q
Caers, J
Vandepitte, Dirk
Baelmans, Martine #
Issue Date: 2003
Publisher: ASME
Series Title: Journal of Electronic Packaging vol:125 issue:4 pages:498-805
ISSN: 1043-7398
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Production Engineering, Machine Design and Automation (PMA) Section
Applied Mechanics and Energy Conversion Section
× corresponding author
# (joint) last author

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