|ITEM METADATA RECORD
|Title: ||New plating path for electroless copper deposition on sputtered barrier layers|
|Authors: ||Lantasov, Yuri|
Min, Woo Sig
|Issue Date: ||1999 |
|Conference: ||European Workshop Materials for Advanced Metallization; March 8-10, 1999; Oostende, Belgium. location:Leuven Belgium|
|Publication status: ||published|
|KU Leuven publication type: ||DI|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
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