Title: Copper-SiLK* semiconductor dielectric interface: XPS surface analysis and RF plasma treatment of the resin
Authors: Lemaire, J. J
Rajagopal, A
Gregoire, C
Pireaux, J. J
Maex, Karen
Waeterloos, Joost #
Issue Date: 1999
Conference: Electrochemical Society Fall Meeting: Interconnects and Contact Metallization for ULSI location:Honolulu, HA, USA date:October 1999
Publication status: published
KU Leuven publication type: IMa
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
# (joint) last author

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