|ITEM METADATA RECORD
|Title: ||Electro-thermal-mechanical analysis of a HQUAD package for high current and high power application|
|Authors: ||Chen, Caroline|
Blansaer, Eddy #
|Issue Date: ||Sep-2005 |
|Publisher: ||TIMA Laboratory|
|Host Document: ||International Workshop on Thermal Investigations of ICs and Systems 2005 pages:173-178|
|Conference: ||Proceedings of the International Workshop on Thermal Investigations of ICs and Systems location:Leuven Belgium date:28/09/05|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Applied Mechanics and Energy Conversion Section|
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