ITEM METADATA RECORD
Title: Electro-thermal-mechanical analysis of a HQUAD package for high current and high power application
Authors: Chen, Caroline
Oprins, Herman
Vandevelde, Bart
Brizar, Guy
Vanderstraeten, Daniel
Blansaer, Eddy #
Issue Date: Sep-2005
Publisher: TIMA Laboratory
Host Document: International Workshop on Thermal Investigations of ICs and Systems 2005 pages:173-178
Conference: Proceedings of the International Workshop on Thermal Investigations of ICs and Systems location:Leuven Belgium date:28/09/05
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Applied Mechanics and Energy Conversion Section
# (joint) last author

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