|ITEM METADATA RECORD
|Title: ||0-Level packaging techniques for flip-chip mounted MMICs|
|Authors: ||De Raedt, W.|
Tilmans, H. #
|Issue Date: ||24-Sep-2001 |
|Publisher: ||European Microwave Association (EuMA)|
|Host Document: ||Proc. European Microwave Conference, London, England, 24-25 September 2001|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||ESAT- TELEMIC, Telecommunications and Microwaves|
Electrical Engineering - miscellaneous
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