Title: 0-Level packaging techniques for flip-chip mounted MMICs
Authors: De Raedt, W.
Brebels, Steven
Monfraix, P.
Carchon, Geert
Jourdain, A.
Tilmans, H. #
Issue Date: 24-Sep-2001
Publisher: European Microwave Association (EuMA)
Host Document: Proc. European Microwave Conference, London, England, 24-25 September 2001
Conference: -
Publication status: published
KU Leuven publication type: IC
Appears in Collections:ESAT- TELEMIC, Telecommunications and Microwaves
Electrical Engineering - miscellaneous
# (joint) last author

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