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Title: Package level interconnect options
Authors: Balachandran, Jayaprakash
Brebels, S
Carchon, Geert
Webers, T
De Raedt, W
Nauwelaers, Bart
Beyne, E #
Issue Date: Apr-2005
Host Document: International Workshop on System Level Interconnect Prediction
Conference: International Workshop on System Level Interconnect Prediction edition:7 location:San Francisco, CA, USA date:2-3 April 2005
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Electrical Engineering - miscellaneous
ESAT- TELEMIC, Telecommunications and Microwaves
# (joint) last author

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