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Title: Foundations for successful RF chip-package co-design: a packaging perspective
Authors: Chandrasekhar, Arun
Beyne, E
De Raedt, W
Nauwelaers, Bart #
Issue Date: 13-Dec-2002
Host Document: URSI Forum 2002
Conference: URSI Forum edition:10 location:Brussels, Belgium date:13 December 2002
Publication status: published
KU Leuven publication type: IC
Appears in Collections:ESAT- TELEMIC, Telecommunications and Microwaves
# (joint) last author

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