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Title: Packaging approach for nano CMOS wiring
Authors: Balachandran, Jayaprakash
Brebels, S
Carchon, Geert
De Raedt, W
Nauwelaers, Bart
Beyne, E #
Issue Date: Jun-2005
Host Document: European Microelectronics and Packaging Conference, IMAPS-Benelux
Conference: European Microelectronics and Packaging Conference edition:15 location:Brugge, Belgium date:12-15 June 2005
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Electrical Engineering - miscellaneous
ESAT- TELEMIC, Telecommunications and Microwaves
# (joint) last author

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