Title: Full wave electromagnetic modelling of complicated 3D packages and interconnections
Authors: Vrancken, Mark ×
Vandenbosch, Guy #
Issue Date: 17-Aug-2002
Conference: URSI General Assembly location:Maastricht date:2002-08-17 to 2002-08-24
Publication status: published
KU Leuven publication type: IC
Appears in Collections:ESAT- TELEMIC, Telecommunications and Microwaves
× corresponding author
# (joint) last author

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