Title: Benchmark of Full Maxwell 3D Electromagnetic Field Solvers on an SOIC8 Packaged and Interconnected Circuit
Authors: Vrancken, Mark ×
Aerts, Wim
Vandenbosch, Guy #
Issue Date: Mar-2006
Publisher: Wiley
Series Title: International Journal of RF and Microwave Computer-Aided Engineering vol:16 issue:2 pages:143-154
ISSN: 1096-4290
Publication status: published
KU Leuven publication type: IT
Appears in Collections:ESAT- TELEMIC, Telecommunications and Microwaves
ESAT - STADIUS, Stadius Centre for Dynamical Systems, Signal Processing and Data Analytics
× corresponding author
# (joint) last author

Files in This Item:
File Description Status SizeFormat
RFMiCAE_vrancken_benchmarking.pdf Published 395KbAdobe PDFView/Open Request a copy

These files are only available to some KU Leuven Association staff members


All items in Lirias are protected by copyright, with all rights reserved.

© Web of science