Title: On the feasibility of die-to-wafer inorganic dielectric bonding
Authors: Wang, Teng
Podpod, Arnita
Capuz, Giovanni
Peng, Lan
Phommahaxay, Alain
Inoue, Fumihiro
Bex, Pieter
Dubey, Vikas
Rebibis, Kenneth June
Miller, Andy
Beyer, Gerald
Beyne, Eric
Issue Date: Sep-2016
Conference: ESTC 2016, Electronics System-Integration Technology Conference edition:6 location:Grenoble, France date:13-15 September 2016
Article number: Electronic publication
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Structural Composites and Alloys, Integrity and Nondestructive Testing

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