Title: Tackling CMP challenges related to the integration of III-V materials for <10nm node applications
Authors: Teugels, Lieve
Ong, Patrick
Waldron, Niamh
Boccardi, Guillaume
Issue Date: 2015
Host Document: Semicon Korea
Conference: Semicon Korea location:Seoul Korea date:2015-02-04
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Supporting Services Campusmanagement Science, Engineering and Technology

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