Title: Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip
Authors: Oprins, Herman
Cherman, Vladimir
Van der Plas, Geert
Maggioni, Federica
De Vos, Joeri
Wang, Teng
Daily, Robert
Beyne, Eric
Issue Date: May-2015
Publisher: IEEE
Host Document: IEEE Electronic Components & Technology Conference - ECTC pages:1134-1141
Conference: IEEE Electronic Components & Technology Conference - ECTC location:San Diego US date:2015-05-26
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Applied Mechanics and Energy Conversion Section

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