Title: Question marks to the extrapolation to lower temperatures in high temperature storage life (HTSL) testing in plastic encapsulated IC's
Authors: Schuddeboom, W ×
W├╝bbenhorst, Michael #
Issue Date: Nov-1996
Series Title: Microelectronics Reliability vol:36 issue:11-12 pages:1935-1938
Abstract: A model has been constructed to describe ball-bond corrosion in HTSL stress testing. In this model ion-mobility has been believed to be the rate determining step and has been found to be non-linear for the anti-popcorn plastic. In HTSL testing an Arrhenius type extrapolation of the mean-time to failure (MTTF) at high temperature has been used, to predict the value at lower temperatures. This method proves to be correct for a low-stress plastic. However possibly it underestimates the value for an anti-popcorn plastic based on ion conductivity data. Strikingly, below the T-g of the anti-popcorn plastic, the reaction rates estimated from the ion conductivity data are the same for both the low-stress and the anti-popcorn plastic encapsulants. Copyright (C) 1996 Elsevier Science Ltd
ISSN: 0026-2714
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Soft Matter and Biophysics
× corresponding author
# (joint) last author

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