Integrating metal-org. frameworks (MOFs) in microelectronics has disruptive potential because of the unique properties of these microporous cryst. materials. Suitable film deposition methods are crucial to leverage MOFs in this field. Conventional solvent-based procedures, typically adapted from powder prepn. routes, are incompatible with nanofabrication because of corrosion and contamination risks. We demonstrate a chem. vapor deposition process (MOF-CVD) that enables high-quality films of ZIF-8, a prototypical MOF material, with a uniform and controlled thickness, even on high-aspect-ratio features. Furthermore, we demonstrate how MOF-CVD enables previously inaccessible routes such as lift-off patterning and depositing MOF films on fragile features. The compatibility of MOF-CVD with existing infrastructure, both in research and prodn. facilities, will greatly facilitate MOF integration in microelectronics. MOF-CVD is the first vapor-phase deposition method for any type of microporous cryst. network solid and marks a milestone in processing such materials.