Title: Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices
Authors: Oba, Yoshiyuki ×
De Messemaeker, Joke
Tyrovouzi, Anna Maria
Miyamori, Yuichi
De Vos, Joeri
Wang, Teng
Beyer, Gerald
Beyne, Eric
De Wolf, Ingrid
Croes, Kristof #
Issue Date: 2015
Publisher: Publication Board, Japanese Journal of Applied Physics
Series Title: Japanese Journal of Applied Physics 1, Regular Papers, Short Notes & Review Papers vol:54 issue:5 pages:1-4
Article number: 05EE01
ISSN: 0021-4922
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Structural Composites and Alloys, Integrity and Nondestructive Testing
× corresponding author
# (joint) last author

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