Title: Thermal and SF6-plasma treatments for improved (sub-)1nm EOT planar and FinFET-based RMG high-k last devices and enabling a simplified scalable CMOS integration scheme
Authors: Veloso, Anabela
Boccardi, Guillaume
Ragnarsson, Lars-Ake
Higuchi, Yuichi
Arimura, Hiroaki
Lee, Jae Woo
Simoen, Eddy
Cho, Moon Ju
Roussel, Philippe
Paraschiv, Vasile
Shi, Xiaoping
Schram, Tom
Chew, Soon Aik
Brus, Stephan
Dangol, Anish
Vecchio, Emma
Sebaai, Farid
Kellens, Kristof
Heylen, Nancy
Devriendt, Katia
Dekkers, Harold
Van Ammel, Annemie
Witters, Thomas
Conard, Thierry
Vaesen, Inge
Richard, Olivier
Bender, Hugo
Athimulam, Raja
Chiarella, Thomas
Thean, Aaron
Horiguchi, Naoto
Issue Date: 2013
Host Document: International Conference on Solid State Devices and Materials - SSDM pages:591-591
Conference: International Conference on Solid State Devices and Materials - SSDM location:Fukuoka Japan date:2013-09-24
Publication status: published
KU Leuven publication type: IC
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors

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