|ITEM METADATA RECORD
|Title: ||Wafer scale copper direct plating on thin PVD RuTa layers: A route to enable filling 30 nm features and below?|
|Authors: ||Armini, Silvia|
|Issue Date: ||2014 |
|Publisher: ||Electrochemical Society|
|Series Title: ||Journal of the Electrochemical Society vol:161 issue:10 pages:D564-D570|
|Publication status: ||published|
|KU Leuven publication type: ||IT|
|Appears in Collections:||Supporting Services Campusmanagement Science, Engineering and Technology|
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