Title: Wafer scale copper direct plating on thin PVD RuTa layers: A route to enable filling 30 nm features and below?
Authors: Armini, Silvia
El-Mekki, Zaid
Nagar, Margalit
Radisic, Alex
Vereecken, Philippe
Issue Date: 2014
Publisher: Electrochemical Society
Series Title: Journal of the Electrochemical Society vol:161 issue:10 pages:D564-D570
ISSN: 0013-4651
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Supporting Services Campusmanagement Science, Engineering and Technology

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