ITEM METADATA RECORD
Title: The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses
Authors: Ivankovic, Andrej
Cherman, Vladimir
Gonzalez, Mario
Vandevelde, Bart
Vandepitte, Dirk
Beyer, Gerald
Beyne, Eric
De Wolf, Ingrid
Issue Date: 2014
Host Document: 15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE pages:1-8
Conference: 15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE location:Gent Belgium date:2013-04-06
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Production Engineering, Machine Design and Automation (PMA) Section
Structural Composites and Alloys, Integrity and Nondestructive Testing

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