ITEM METADATA RECORD
Title: Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips
Authors: Wong, C.S
Ivankovic, Andrej
Cowley, A
Bennett, N.S
Danilewsky, A
Gonzalez, Mario
Cherman, Vladimir
Vandevelde, Bart
De Wolf, Ingrid
McNally, P.J
Issue Date: 2014
Host Document: IEEE 64th Electronic Components and Technology Conference - ECTC pages:1517-1522
Conference: IEEE 64th Electronic Components and Technology Conference - ECTC location:Lake Buena Vista, FL USA date:2014-05-27
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Supporting Services Campusmanagement Science, Engineering and Technology

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