|ITEM METADATA RECORD
|Title: ||Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips|
|Authors: ||Wong, C.S|
De Wolf, Ingrid
|Issue Date: ||2014 |
|Host Document: ||IEEE 64th Electronic Components and Technology Conference - ECTC pages:1517-1522|
|Conference: ||IEEE 64th Electronic Components and Technology Conference - ECTC location:Lake Buena Vista, FL USA date:2014-05-27|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Supporting Services Campusmanagement Science, Engineering and Technology|
|Files in This Item:
There are no files associated with this item.
Request a copy
All items in Lirias are protected by copyright, with all rights reserved.
© Web of science