Title: Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements
Authors: De Wolf, Ingrid
Simons, Veerle
Lofrano, Melina
Cherman, Vladimir
De Vos, Joeri
Van der Plas, Geert
Beyne, Eric
Issue Date: Sep-2014
Host Document: Electronics System-Integration Technology Conference - ESTC pages:978-983
Conference: Electronics System-Integration Technology Conference - ESTC location:Helsinki Finland date:2014-09-16
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Supporting Services Campusmanagement Science, Engineering and Technology

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