|ITEM METADATA RECORD
|Title: ||Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements|
|Authors: ||De Wolf, Ingrid|
De Vos, Joeri
Van der Plas, Geert
|Issue Date: ||Sep-2014 |
|Host Document: ||Electronics System-Integration Technology Conference - ESTC pages:978-983|
|Conference: ||Electronics System-Integration Technology Conference - ESTC location:Helsinki Finland date:2014-09-16|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Supporting Services Campusmanagement Science, Engineering and Technology|
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