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Title: Reliability challenges for barrier/liner system in high aspect ratio through silicon vias
Authors: Li, Yunlong
Van Huylenbroeck, Stefaan
Van Besien, Els
Shi, Xiaoping
Wu, Chen
Stucchi, Michele
Beyer, Gerald
Beyne, Eric
De Wolf, Ingrid
Croes, Kristof
Issue Date: 10-Aug-2014
Publisher: Elsevier
Series Title: Microelectronics Reliability vol:54 issue:9-10 pages:1949-1952
Conference: 25th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF) location:Berlin, Germany date:29 Sept-02 Oct 2014
ISSN: 0026-2714
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Supporting Services Campusmanagement Science, Engineering and Technology
Department of Materials Engineering - miscellaneous
Structural Composites and Alloys, Integrity and Nondestructive Testing

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