Title: 2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms
Authors: Agrawal, Prashant
Milosevic, Dragomir
Rgahavan, Praveen
Catthoor, Francky
Van der Perre, Liesbet
Beyne, Eric
Varadarajan, R
Issue Date: May-2014
Host Document: IEEE International Interconnect Technology Conference vol:2014 pages:381-384
Conference: IEEE International Interconnect Technology Conference edition:2014 location:San Jose CA, USA date:20-23 May 2014
Publication status: published
KU Leuven publication type: IC
Appears in Collections:ESAT- TELEMIC, Telecommunications and Microwaves
Associated Section of ESAT - INSYS, Integrated Systems

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