|ITEM METADATA RECORD
|Title: ||2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms|
|Authors: ||Agrawal, Prashant|
Van der Perre, Liesbet
|Issue Date: ||May-2014 |
|Host Document: ||IEEE International Interconnect Technology Conference vol:2014 pages:381-384|
|Conference: ||IEEE International Interconnect Technology Conference edition:2014 location:San Jose CA, USA date:20-23 May 2014|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||ESAT- TELEMIC, Telecommunications and Microwaves|
Associated Section of ESAT - INSYS, Integrated Systems
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