Title: Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects
Authors: Panchenko, Luliana ×
Croes, Kristof
De Wolf, Ingrid
De Messemaeker, J.
Beyne, Eric
Wolter, Klaus-Juergen #
Issue Date: 2014
Publisher: North-Holland
Series Title: Microelectronic Engineering vol:117 pages:26-34
ISSN: 0167-9317
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Structural Composites and Alloys, Integrity and Nondestructive Testing
× corresponding author
# (joint) last author

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