|ITEM METADATA RECORD
|Title: ||Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects|
|Authors: ||Panchenko, Luliana ×|
De Wolf, Ingrid
De Messemaeker, J.
Wolter, Klaus-Juergen #
|Issue Date: ||2014 |
|Series Title: ||Microelectronic Engineering vol:117 pages:26-34|
|Publication status: ||published|
|KU Leuven publication type: ||IT|
|Appears in Collections:||Structural Composites and Alloys, Integrity and Nondestructive Testing|
× corresponding author|
# (joint) last author|
| ||These files are only available to some KU Leuven Association staff members|
All items in Lirias are protected by copyright, with all rights reserved.
© Web of science