Title: Chip-package interaction in 3D stacked IC packages using Finite Element Modelling
Authors: Vandevelde, Bart ×
Ivankovic, Andrej
Debecker, B.
Lofrano, M.
Vanstreels, K.
Guo, W
Cherman, V.
Gonzalez, M.
Van der Plas, G.
De Wolf, Ingrid
Beyne, E.
Tokei, Z. #
Issue Date: 2014
Series Title: Microelectronics Reliability vol:54 issue:6-7 pages:1200-1205
Conference: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) edition:14 location:Wroclaw, Poland date:14-17 April, 2013
ISSN: 0026-2714
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Structural Composites and Alloys, Integrity and Nondestructive Testing
Mechanical Engineering - miscellaneous
× corresponding author
# (joint) last author

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