Title: A novel method to measure the internal pressure of MEMS thin-film packages
Authors: Wang, Bo ×
De Coster, Jeroen
Wevers, Martine
De Wolf, Ingrid #
Issue Date: 2013
Publisher: Elsevier
Series Title: Microelectronics Reliability vol:53 issue:9-11 pages:1663-1666
ISSN: 0026-2714
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Structural Composites and Alloys, Integrity and Nondestructive Testing
× corresponding author
# (joint) last author

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