|ITEM METADATA RECORD
|Title: ||Full reliability study of advanced metallization options for 30 nm ½pitch interconnects|
|Authors: ||Croes, Kristof|
Siew, Yong Kong
|Issue Date: ||2013 |
|Series Title: ||Microelectronic Engineering vol:106 pages:210-213|
|Publication status: ||published|
|KU Leuven publication type: ||IT|
|Appears in Collections:||Non-KU Leuven Association publications|
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