Title: Direct Copper Plating
Authors: Radisic, Aleksandar
Vereecken, Philippe
Series Editors: David J, Lockwood
Issue Date: 2014
Publisher: Springer Science+Business Media New York
Series Title: Nanostructure Science and Technology
Host Document: Copper Electrodeposition for Nanofabrication of Electronics Device edition:1st pages:131-173
Article number: 7
ISBN: 978-1-4614-9175-0
Publication status: published
KU Leuven publication type: IHb
Appears in Collections:Centre for Surface Chemistry and Catalysis

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