|ITEM METADATA RECORD
|Title: ||Direct Copper Plating|
|Authors: ||Radisic, Aleksandar|
|Series Editors: ||David J, Lockwood|
|Issue Date: ||2014 |
|Publisher: ||Springer Science+Business Media New York|
|Series Title: ||Nanostructure Science and Technology|
|Host Document: ||Copper Electrodeposition for Nanofabrication of Electronics Device edition:1st pages:131-173|
|Article number: ||7|
|Publication status: ||published|
|KU Leuven publication type: ||IHb|
|Appears in Collections:||Centre for Surface Chemistry and Catalysis|
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