Title: Integration and packaging MEMS directly above active CMOS
Authors: Pieters, Philip ×
Qi, Diane
Witvrouw, Ann #
Issue Date: 2007
Publisher: IEEE
Host Document: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration pages:32-32
Conference: International Symposium on High Density Packaging and Microsystems Integration location:Shanghai, China date:Jun 26-28, 2007
ISBN: 978-1-4244-1252-5
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Non-KU Leuven Association publications
× corresponding author
# (joint) last author

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