Title: Temporary 0-level MEMS packaging using a heat decomposable sealing ring
Authors: Bogaerts, L ×
Phommahaxay, A
Gerets, C
Jaenen, P
Van Hoof, R
Severi, S
De Coster, J
Beernaert, R
Rudra, S
Soussan, P
Witvrouw, Ann #
Issue Date: 2011
Publisher: Elsevier
Host Document: Procedia Engineering vol:25 pages:1497-1500
Conference: 25th Eurosensors Conference location:Athens, Greece date:Sep 04-07, 2011
ISBN: *****************
ISSN: 1877-7058
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Non-KU Leuven Association publications
× corresponding author
# (joint) last author

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