Title: Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC
Authors: Minas, Nikolaos
Van der Plas, Geert
Oprins, Herman
Mercha, Abdelkarim
Cherman, Vladimir
Torregiani, Cristina
Rakowski, Michal
Marchal, Pol
Issue Date: 2012
Publisher: Institute of Electrical and Electronics Engineers
Series Title: IEEE Transactions on Semiconductor Manufacturing vol:25 issue:3 pages:365-371
ISSN: 0894-6507
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Non-KU Leuven Association publications

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