Title: Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage
Authors: Cherman, Vladimir
De Messemaeker, Joke
Croes, Kristof
Dimcic, Biljana
Van der Plas, Geert
De Wolf, Ingrid
Beyer, Gerald
Swinnen, Bart
Beyne, Eric
Issue Date: 2012
Host Document: IEEE International Reliability Physics Symposium- IRPS pages:2B-3
Conference: IEEE International Reliability Physics Symposium- IRPS location:Anaheim, CA USA date:14/04/2012
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Structural Composites and Alloys, Integrity and Nondestructive Testing

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