Title: Test structures for characterization of through-silicon vias
Authors: Stucchi, Michele
Perry, Daniel
Katti, Guruprasad
Dehaene, Wim
Velenis, Dimitrios
Issue Date: 2012
Publisher: Institute of Electrical and Electronics Engineers
Series Title: IEEE Transactions on Semiconductor Manufacturing vol:25 issue:3 pages:355-364
ISSN: 0894-6507
Publication status: published
KU Leuven publication type: IT
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors

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