|ITEM METADATA RECORD
|Title: ||Test structures for characterization of through-silicon vias|
|Authors: ||Stucchi, Michele|
|Issue Date: ||2012 |
|Publisher: ||Institute of Electrical and Electronics Engineers|
|Series Title: ||IEEE Transactions on Semiconductor Manufacturing vol:25 issue:3 pages:355-364|
|Publication status: ||published|
|KU Leuven publication type: ||IT|
|Appears in Collections:||ESAT - MICAS, Microelectronics and Sensors|
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