Title: Chip package interaction (CPI): thermo mechanical challenges in 3D technologies
Authors: Gonzalez, Mario
Vandevelde, Bart
Ivankovic, Andrej
Cherman, Vladimir
Debecker, Bjorn
Lofrano, Melina
De Wolf, Ingrid
Beyer, Gerald
Swinnen, Bart
Tokei, Zsolt
Beyne, Eric
Issue Date: 2012
Host Document: 14th Electronics Packaging Technology Conference - EPTC
Conference: 14th Electronics Packaging Technology Conference - EPTC location:Singapore date:05/12/2012
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Non-KU Leuven Association publications

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