Title: MEMS packaging and reliability: An undividable couple
Authors: Tilmans, H. A. C ×
De Coster, J
Helin, P
Cherman, V
Jourdain, A
De Moor, P
Vandevelde, B
Pham, N. P
Zekry, Joseph
Witvrouw, Ann
De Wolf, Ingrid #
Issue Date: 2012
Series Title: Microelectronics Reliability vol:52 issue:9-10 pages:2228-2234
Conference: 23rd European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF) in Conjunction with the 3rd International Symposium on Reliability of Optoelectronics for Space (ISROS) location:Cagliari, Italy date:1-5 October 2012
ISSN: 0026-2714
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Structural Composites and Alloys, Integrity and Nondestructive Testing
× corresponding author
# (joint) last author

Files in This Item:
File Description Status SizeFormat
pub06643.pdfMain article Published 1360KbAdobe PDFView/Open Request a copy

These files are only available to some KU Leuven Association staff members


All items in Lirias are protected by copyright, with all rights reserved.

© Web of science