International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems edition:13 location:Cascais, Lisbon, Portugal date:16-18 April 2012
In this study, the fatigue performance of solder joints in four point bending test was evaluated by a novel finite-element modeling method. A simplified modeling technique was implemented in order to focus on the behavior of the critical solder joint. The fatigue life was estimated by taking into account the creep behavior of solder joints. Morrow's fatigue model was utilized to determine the fatigue life. The results were compared with the ongoing test results. Some additional studies were performed in order to observe the reliability of the modeling method and the effect test parameters.