Title: Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
Authors: Dimcic, Biljana ×
Labie, Riet
De Messemaeker, Joke
Vanstreels, K
Croes, K
Verlinden, Bert #
Issue Date: 2012
Series Title: Microelectronics Reliability vol:52 issue:9-10 pages:1971-1974
ISSN: 0026-2714
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Structural Composites and Alloys, Integrity and Nondestructive Testing
× corresponding author
# (joint) last author

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